New Technology for RF device, Hybrid IC, and um IC

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Introduction

The primary aim of this Special Issue is to explore and disseminate cutting-edge advancements in the fields of Radio Frequency (RF) devices, Hybrid Integrated Circuits (Hybrid ICs), and micro-scale Integrated Circuits (um ICs). This issue will serve as a platform for researchers, engineers, and industry professionals to share innovative solutions, methodologies, and applications that address the evolving challenges in these domains.

The specific objectives include:

1. Advancing RF Device Technology: To highlight breakthroughs in RF device design, including miniaturization, energy efficiency, and performance enhancement, particularly for applications in 5G/6G communications, IoT, and satellite systems. 
2. Innovations in Hybrid ICs: To showcase novel approaches in Hybrid ICs, focusing on the integration of diverse materials and technologies to achieve superior functionality, reliability, and scalability. 
3. Micro-Scale IC Development: To explore the latest trends in um ICs, emphasizing advancements in fabrication techniques, material science, and circuit design for applications in wearable electronics, medical devices, and autonomous systems. 
4. Interdisciplinary Collaboration: To foster cross-disciplinary research by encouraging contributions from fields such as materials science, nanotechnology, and signal processing, thereby driving holistic innovation.

These aims will be met through a rigorous peer-review process, ensuring the publication of high-quality, original research articles, reviews, and case studies. The Special Issue will also feature invited contributions from leading experts to provide authoritative insights and perspectives.

List of topic areas

· Advancing RF Device Technology
· Innovations in Hybrid ICs
· Micro-scale IC development
· Interdisciplinary Collaboration

Submissions Information

Submissions are made using ScholarOne Manuscripts. Registration and access are available at: https://mc.manuscriptcentral.com/miij
Author guidelines must be strictly followed. Please see: https://www.emeraldgrouppublishing.com/journal/mi#jlp_author_guidelines
Authors should select (from the drop-down menu) the special issue title at the appropriate step in the submission process, i.e. in response to “Please select the issue you are submitting to”.

Submitted articles must not have been previously published, nor should they be under consideration for publication anywhere else while under review for this journal.

Key deadlines

Abstract submissions: 1 July 2025 to 30 March 2026 (Email for submissions: syzhang@hit.edu.cn)
Manuscripts submission: 1 July 2025 - 30 April 2026