Advanced Interconnects, Packaging Materials and Reliability in Microelectronics

Submit your paper here from 1 February 2026!

Purpose of the Special Issue

The increasing complexity of microelectronic systems, driven by heterogeneous integration, high-power density operation and advanced semiconductor technologies, has intensified the need for reliable interconnects, packaging materials and structural integrity. Challenges related to material behaviour, interface reliability, thermal–mechanical coupling and long-term degradation are central to the performance and lifetime of modern electronic devices.

This Special Issue aims to present recent advances in materials, processes, modelling and reliability assessment relevant to microelectronics packaging and interconnection, with a focus on both fundamental understanding and practical engineering applications. The issue aligns with the scope of Microelectronics International in providing a multidisciplinary platform covering materials, processes, design and system-level considerations.

Scope and Topics

Submissions are invited that address experimental, numerical and applied aspects of microelectronics packaging and interconnect technologies. Topics of interest include, but are not limited to:

• Advanced chip attachment and interconnection technologies
• Sintered metal, solder and solid-state bonding materials
• Microelectronic materials and interface characterisation
• Reliability and failure mechanisms under thermal, mechanical and electrical loading
• Thermo-mechanical behaviour of packaging materials and joints
• Packaging solutions for high-power and extreme-temperature applications
• Thermal management in advanced electronic packages
• Wafer-level and wafer-scale packaging
• Ceramic, organic and flexible substrates
• MEMS and sensor packaging
• Multiphysics modelling and simulation of packaging reliability
• Quantum electronics packaging and reliability
• Industrial case studies and manufacturing challenges

Submission Information

Submissions are made using ScholarOne Manuscripts. Registration and access are available at: https://mc.manuscriptcentral.com/miij
Author guidelines must be strictly followed. Please see: ​journal’s author guidelines hyperlink​: https://www.emeraldgrouppublishing.com/journal/mi#jlp_author_guidelines

Authors should select (from the drop-down menu) the special issue title at the appropriate step in the submission process, i.e. in response to “Please select the issue you are submitting to”.  

Submitted articles must not have been previously published, nor should they be under consideration for publication anywhere else, while under review for this journal.

Key Deadlines

Opening date for manuscripts submissions: 1 February 2026
Closing date for manuscripts submission: 1 February 2027